Photocad with technical contribution at the Technology Day Printed Circuit Board & Assembly

Every year, experts from industry and research as well as specialists from the sector come together at the Technology Day PCB & Assembly conference to communicate new concepts and findings relating to the design of PCBs and assemblies.

Photocad will also be represented with a contribution: Dipl.-Ing. Axel Meyer, Head of Sales and Marketing, will share his expertise on the topic of “Solder paste stencils – requirements and possibilities” as a speaker on the opening day.

The conference will take place from 24. – May 25, 2023, at the Vogel Convention Center in Würzburg, Germany, and offers space for various exhibitors, workshops and discussion forums in addition to presentations.

With our guest tickets you exclusively receive a 20% discount on the regular ticket price (valid for day and combination tickets). To do so, enter the following discount code when registering via the event website: TLP23-SOCIAL.

For the Technology Days register and save with Photocad.