SMT-STENCILS

QUALITY FACTORS

There are good reasons to rely on our high-precision SMT stencils for solder paste printing. Well over half of all faulty connections in SMT assembly are due to defective solder paste. The company that masters this step is clearly ahead of the competition, because doing so minimizes the costs for reworking and scrap. At the same time, the quality of the stencil is crucial for a successful outcome. We use the laser-cutting process to manufacture our SMT stencils.


To optimize your solder paste printing, we use the following systems
for production of SMT stencils of the highest precision:

The latest laser-cutting technology with quick check system (CCD camera-based measuring system to monitor pad location and size)

LPKF Turbocut System:
special lens rotation mechanism in the laser cutting head to optimize the contours of circular openings to almost 100% (especially for BGAs)

Motorized beam expander:
software-controlled adjustment of the laser focus position for every desired thickness of material. The resulting precise focus setting ensures an optimally conical shape and low-residue laser-cut edges.

After-treatment by our FSL precision brushing equipment BM2/6 takes care of thorough, extra-fine polishing of all the laser stencils we supply.

100% SECURITY CHECK

We test the quality of SMT stencils with LPKF StencilCheck. The software creates a scanned image of the stencil and compares it to the production data. Discrepancies are displayed graphically on the screen. All test results can be summarized in a report and traced back. This is our guarantee of complete quality management.

LASER CUTTING

Extremely high energy density and focus make the laser an optimal tool for making precision cuts, and thus for the manufacture of high-precision SMT stencils.

The laser source we use generates a highly focused laser beam with a wavelength of 1064 nm (infrared). At its focal point, the energy density is so high that it can cut stainless steel sheets of 500 μ thickness. The accuracy of the laser systems is ± 2 µm. The thermal stress on the material along the cut is extremely small.