Press Review

Cleaning prevents rejects

06.11.2014
Aus: industrial magazine

“To avoid misprints during SMT, the adhering residues of solder paste on the underside of the stencil must be removed immediately. Otherwise, scrap would be produced, causing unnecessary costs. SMT Photocad has therefore now included the cleaning products of Kissel + Wolf GmbH from Wiesloch, which are specially adapted to such stencils, in its portfolio.”

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Axel Meyer
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